Development history of copper clad laminate

CCL——also known as the substrate. It’s a plate-shaped material produced by immersing a reinforcing material in the resin and coating a copper foil on one or both sides and hot pressing. It is the basic material for PCBs, often called the substrat……

CCL——also known as the substrate. It’s a plate-shaped material produced by immersing a reinforcing material in the resin and coating a copper foil on one or both sides and hot pressing. It is the basic material for PCBs, often called the substrate. When it is used in the production of multi-layer boards, it is also called core board (CORE).

History

Copper Clad Laminate (CCL), which is made of wood pulp paper or fiberglass cloth, impregnated with resin, coated with copper foil on one or both sides, and hot pressed.

CCL is the basic material of the electronics industry. It is mainly used in the manufacture of printed circuit boards (PCBs). It is widely used in televisions, radios, computers, computers, mobile phones and other electronic products.

The CCL industry has a history of nearly one hundred years. This is an inseparable technological development history in parallel with the electronic information industry, especially with the PCB industry. The development of copper clad laminates began in the early 20th century. At that time, there were gratifying advances in the manufacture of copper clad laminates because of the use of resins, reinforcing materials, and substrates, such as:

In 1909, Dr. Bakeland developed and applied phenolic resin.

In 1934, Germany Schlack synthesized epoxy resin from bisphenol A and epichlorohydrin.

In 1938, Owens Corning Fiberglass Group of the United States began producing fiberglass.

In 1939, Anaconda Corporation of the United States pioneered the production of copper foil by electrolysis.

The development of the above technologies has laid an important foundation and created the necessary conditions for the development of copper clad laminates. Since then, with the invention and application of integrated circuits, the miniaturization and high performance of electronic products have promoted the further development of CCL technology and production.

The Buildup Multilayer technology has developed rapidly, and a variety of new substrate materials such as resin-coated copper foil (RCC) have emerged.

ZTELEC Group is a manufacturer of copper clad laminated sheet and many other kinds of insulation materials with a history of 60 years.

Contact Us: serina@ztaero.com

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