Classification and grade of copper clad laminate CCL

Classification CCL supplied on the market, depending on the substrate, can be divided into the following categories: Paper substrate; Fiberglass cloth substrate; Synthetic fiber cloth substrate; Non-woven substrate; Composite substrate;other. The t……

Classification

CCL supplied on the market, depending on the substrate, can be divided into the following categories:

Paper substrate; Fiberglass cloth substrate; Synthetic fiber cloth substrate; Non-woven substrate; Composite substrate;other.

The term “substrate” refers to a reinforcing material such as paper or fiberglass cloth.

If classified by shape, it can be divided into the following four types:

CCL; Shield; Multilayer board material; Special substrate.

The above four types of sheets are described as below:

CCL, refers to substrates such as paper and fiberglass cloth, impregnated with resin, and made into adhesive sheets (adhesive paper and tape). After combining several sheets of bonding sheets, copper foil is coated on one or both sides. Then it is hot-pressed, made into a plate-like product.

Shielding plate refers to a copper clad laminate with a shield or graphic line on the inner layer. As long as the two-sided circuit is processed, it can be a multi-layer circuit board, also known as “clad laminate with shielding layer.”

The material for the multilayer board refers to a copper clad laminate and a bonding sheet (adhesive tape) for producing a multilayer wiring board, also including a resin coated copper foil (RCC) for a laminate method. The so-called multi-layer board refers to a circuit board having two surfaces and an inner layer having a plurality of pattern lines.

The special substrate refers to a laminate for an additive method, a metal core substrate, or the like, and a special plate that does not fall into the above-mentioned types of sheets. The metal core substrate also includes a resin coated substrate (FBC or the like).

Grade

Commonly used copper clad laminates are as follows:

FR-1 ─ phenolic cotton paper, this substrate is commonly known as bakelite (more economic than FR-2)

FR-2 ─ phenolic cotton paper,

FR-3 ─ Cotton paper, epoxy resin

FR-4 ─ Woven glass, epoxy resin

FR-5 ─ glass cloth, epoxy resin

FR-6 ─ matte glass, polyester

G-10 ─ glass cloth, epoxy resin

CEM-1 ─ cotton paper, epoxy resin (flame retardant)

CEM-2 ─ cotton paper, epoxy resin (non-flame retardant)

CEM-3 ─ glass cloth, epoxy resin

CEM-4 ─ glass cloth, epoxy resin

CEM-5 ─ glass cloth, polyester

AIN – aluminum nitride

SIC – Silicon Carbide

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