Brief Introduction of Epoxy Board/Epoxy Resin Fiberglass Cloth Laminated Board

           Epoxy board, also known as epoxy glass fiber board, contains active epoxy groups in the molecular structure, allowing them to crosslink with various types of curing agents to form insoluble, infusible polymer with three-dimensional netwo……

          

Epoxy board, also known as epoxy glass fiber board, contains active epoxy groups in the molecular structure, allowing them to crosslink with various types of curing agents to form insoluble, infusible polymer with three-dimensional network structures.

Introduction

Epoxy board, also known as epoxy fiberglass board, epoxy phenolic laminated glass cloth board. Epoxy resin is an organic polymer compound containing two or more epoxy groups in the molecule, except for some, their relative molecular mass is not high. The molecular structure of the epoxy resin is characterized by the presence of an active epoxy group in the molecular chain, and the epoxy group may be located at the end, in the middle or in a ring structure of the molecular chain. Since the molecular structure contains an active epoxy group, they can be cross-linked with various types of curing agents to form an insoluble, infusible polymer having a three-dimensional network structure.

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Description

Epoxy board: It is made of glass fiber cloth, epoxy resin by being heated and pressed. It has high mechanical properties at medium temperature and stable electrical performance under high humidity. It is suitable for high-insulation structural parts for machinery, electrical appliances and electronics, with high mechanical and dielectric properties,good heat resistance and moisture resistance. Heat resistance is class F (155 degrees).

Specification thickness: 0.5~100mm

It is heated and deformed at a high temperature of 180 ° C, and is generally not heated with other metals, which may cause deformation of the metal sheet.

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Application characteristics

  1.  Various forms. Various resins, curing agents, and modifier systems can be adapted to the requirements of the form for a variety of applications, ranging from very low viscosity to high melting point solids.
  2.  Easy to cure. Epoxy resin system can be cured in the temperature range of 0-180 °C by using various curing agents.
  3.  Strong adhesion. The presence of polar hydroxyl and ether linkages inherent in the epoxy resin molecular chain provides high adhesion to a wide variety of materials. When the epoxy resin is cured, the shrinkage is low, and the internal stress generated is small, which also contributes to an improvement in adhesion strength.
  4.  Low shrinkage. The reaction of the epoxy resin and the curing agent used is carried out by a direct addition reaction or a ring-opening polymerization reaction of an epoxy group in a resin molecule, without the release of water or other volatile by-products. They exhibit very low shrinkage (less than 2%) during curing compared to unsaturated polyester resins and phenolic resins.
  5. Mechanical properties. The cured epoxy resin system has excellent mechanical properties. 

Contact Us: serina@ztaero.com

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