Application Characteristics of G11 Epoxy Board

Application characteristics of G11 epoxy board:

One: various forms. All kinds of resin, curing agent and modifier systems can almost meet the requirements of various applications. Their range can be from very low viscosity to high melting point solid. Secondly, they are easy to cure. The epoxy resin system with various curing agents can be cured in the temperature range of 0-180 ℃. Thirdly, it has strong adhesion. The existence of polar hydroxyl and ether bond in the molecular chain of epoxy resin makes it have high adhesion to various substances. The low shrinkage of epoxy resin during curing, the small internal stress produced, which also helps to improve the adhesion strength; fourthly, the low shrinkage. The reaction between epoxy resin and curing agent is carried out by direct addition reaction or ring opening polymerization of epoxide in resin molecule. No water or other volatile by-products are released. Compared with unsaturated polyester resin and phenolic resin, they show very low shrinkage (less than 2%) in the curing process. The cured epoxy resin system has excellent mechanical properties.


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